Conformal coating is the norm for most electronic manufacturers. Conformal coating is a transparent layer of thin polymetric film, which “conforms” to the contour of the circuit board providing protection to the electronic circuit board. This application is used to protect against moisture, chemicals, dust particles, and extreme temperatures.
Another form of coating is called potting. With electronics that use surface mount technology, potting is the process that uses low glass transition temperature compounds such as polyurethane or silicone to fill a complete electronic assembly with a solid or gelatinous compound for resistance.
So why should you choose potting rather then conformal coating? What does the application protect against?
- Vibration dampening (stopping parts from breaking due to vibration)
- Heat dissipation (potting helps dissipate the heat coming from a component)
- Moisture ingress
- Security
- Light sensitive parts
- Mechanical protection
Also, there are different ways of potting:
- Filling a cavity
- Dam and fill
- Dipping
- Dispensing potting directly
onto the board
Air entrapment can be a problem when potting. There are different ways of removing the entrapped air or degassing the potting material before potting and after potting but before cure.
- Vacuum degassing of individual potting components
- Slow mixing of components to reduce air entering the mixture
- Vacuum degassing of mixed resin
- Centrifuge degassing of mixed components
- Vacuum degassing of potted components
- Low temperature Pre-cure degassing of potted components
- Vibration degassing of potted
There are a lot of factors in determining how a board is potted. Most CM’s will ask you for the assembly to determine the best process, conformal vs. potting. At Valtronic, your best interest is our priority. We can add our manufacturing expertise at any phase from beginning to end as you may need.
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