White Paper: Large & Thin Dies

There is a growing interest among micro-electronics manufacturers in using large die in their designs, especially for medical imaging systems, including various scanners, MRI systems and ultrasound systems. Such larger and thinner dies however are prone to break more easily. Valtronic developed an adequate process making the pick-and-place operation for such dies much safer.

Please fill out the following form to gain access to the white paper.

All fields marked with a “*” are required.